Publication source
Journal of the Society for Information Display
Volume 26, Issue 4, April 2018
Authors
Hylke B. Akkerman, Raghu K. Pendyala, Pradeep Panditha, Ahmed Salem, Jie Shen, Peter van de Weijer, Piet C.P. Bouten, Suzanne H.P.M. de Winter, Karin van Diesen-Tempelaars, Gerard de Haas, Soeren Steudel, Ching-Yu Huang, Ming-Hsiang Lai, Yen-Yu Huang, Ming-Hua Yeh, Auke Jisk Kronemeijer, Paul Poodt, Gerwin H. Gelinck
Abstract
We present a thin-film dual-layer bottom barrier on polyimide that is compatible with 350°C backplane processing for organic light-emitting diode displays and that can facilitate foldable active-matrix organic light-emitting diode devices with a bending radius of <2 mm. We demonstrate organic light-emitting diodes that survive bending over 0.5 mm radius for 10.000× based on the high-temperature bottom barrier. Furthermore, we show compatibility of the bottom barrier with the backplane process by fabricating active-matrix organic light-emitting diode displays on GEN1-sized substrates.
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